The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2025
Filed:
Oct. 04, 2019
Applicant:
Infineon Technologies Austria Ag, Villach, AT;
Inventor:
Carsten von Koblinski, Villach, AT;
Assignee:
Infineon Technologies Austria AG, Villach, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/3065 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 29/34 (2006.01);
U.S. Cl.
CPC ...
H01L 24/06 (2013.01); H01L 21/3065 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 23/49822 (2013.01); H01L 24/03 (2013.01); H01L 24/04 (2013.01); H01L 24/48 (2013.01); H01L 29/34 (2013.01); H01L 2224/03502 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/48227 (2013.01);
Abstract
In an embodiment, a semiconductor device includes a semiconductor body having a first major surface, a second major surface opposing the first major surface and at least one transistor device structure, a source pad and a gate pad arranged on the first major surface, a drain pad and at least one further contact pad coupled to a further device structure. The drain pad and the at least one further contact pad are arranged on the second major surface.