The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2025
Filed:
Aug. 03, 2021
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Yoshihito Otsubo, Nagaokakyo, JP;
Yukio Yamamoto, Nagaokakyo, JP;
MURATA MANUFACTURING CO., LTD., Kyoto-Fu, JP;
Abstract
A module () includes a substrate () having a first main surface () and including wiring, a first component () having a circuit surface (), mounted on the first main surface () such that the circuit surface () faces the first main surface (), and having a ground terminal () on the circuit surface (), a first sealing resin () disposed to cover the first main surface () and the first component (), and a heat dissipation portion () provided along an upper surface of the first sealing resin (). The wiring is connected to the ground terminal (), and the module further includes a heat conducting member () connecting the wiring and the heat dissipation portion ().