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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12255115 B1

PDFFull Text
Date of Patent:
Mar. 18, 2025

Filed:

Mar. 26, 2024

Electronic devices in semiconductor package cavities

Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Christopher Daniel Manack, Flower Mound, TX (US);

Patrick Francis Thompson, Allen, TX (US);

Qiao Chen, Flower Mound, TX (US);

Assignee:

TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);

Attorneys:

Dawn Jos

Frank D. Cimino

Primary Examiner:

Mouloucoulaye Inoussa

Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 23/315 (2013.01); H01L 21/4825 (2013.01); H01L 21/565 (2013.01); H01L 23/49513 (2013.01); H01L 23/4952 (2013.01); H01L 23/49575 (2013.01); H01L 24/02 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/024 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/73207 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/07025 (2013.01); H01L 2924/19104 (2013.01);
Abstract

In examples, a semiconductor device comprises a semiconductor package including a mold compound covering a semiconductor die. The semiconductor package has a surface and a cavity formed in the surface. The semiconductor device comprises an electronic device positioned within the cavity, the electronic device coupled to the semiconductor die via a conductive terminal extending through the mold compound.

Find Patent Forward Citations

Manack, Christopher. (2025). Electronic devices in semiconductor package cavities (U.S. Patent No. 12255115). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12255115

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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