The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 18, 2025

Filed:

Sep. 20, 2022
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Kwang Yeun Won, Suwon-si, KR;

Jong Ho Lee, Suwon-si, KR;

Yoo Jeong Lee, Suwon-si, KR;

Hyung Jong Choi, Suwon-si, KR;

Chung Yeol Lee, Suwon-si, KR;

So Jung An, Suwon-si, KR;

Woo Kyung Sung, Suwon-si, KR;

Myung Jun Park, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/232 (2006.01); H01G 4/224 (2006.01); H01G 4/30 (2006.01);
U.S. Cl.
CPC ...
H01G 4/2325 (2013.01); H01G 4/224 (2013.01); H01G 4/30 (2013.01);
Abstract

A multilayer electronic component includes: a body including dielectric layers and first and second internal electrodes and having first to sixth surfaces; a first external electrode including a first connection portion, disposed on the third surface, and a first band portion extending from the first connection portion onto a portion of the first surface; a second external electrode including a second connection portion, disposed on the fourth surface, and a second band portion extending from the second connection portion onto a portion of the first surface; an insulating layer disposed on the second surface and disposed to extend to the first and second connection portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion. The insulating layer includes a fluorine-based organic material.


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