The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 18, 2025

Filed:

Nov. 24, 2020
Applicant:

Steering Solutions Ip Holding Corporation, Saginaw, MI (US);

Inventors:

Michael C. Hallman, Birch Run, MI (US);

Wayne B. Thomas, Saginaw, MI (US);

Shawn M. Barber, Bay City, MI (US);

Matthew W. Mielke, Freeland, MI (US);

Donald E. Lemke, Frankenmuth, MI (US);

Kenneth G. Johnston, Freeland, MI (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/06 (2006.01); H01F 27/28 (2006.01); H01F 27/29 (2006.01); H01F 37/00 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01F 27/06 (2013.01); H01F 27/292 (2013.01); H01F 37/00 (2013.01); H05K 1/181 (2013.01); H05K 3/3426 (2013.01); H01F 2027/065 (2013.01); H01F 27/2895 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10545 (2013.01); H05K 2203/1484 (2013.01);
Abstract

An inductor comprises a base having a top surface, a bottom surface, and at least one side surface. The top surface is spaced from the bottom surface. The at least one side surface connects the top surface to the bottom surface. A core is located on the top surface and coupled to the base. At least one coil extends helically about the core. The at least one coil has at least one end extending outwardly from said core. At least one lead is coupled to the at least one coil and extending outwardly from the base in a coplanar relationship with the bottom surface. A circuit card assembly including the inductor and a method of manufacturing the circuit card assembly are also disclosed herein.


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