The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2025
Filed:
Dec. 16, 2021
Dupont Toray Specialty Materials Kabushiki Kaisha, Tokyo, JP;
Dupont Specialty Materials Korea Ltd., Cheonan-si, KR;
Sawako Horie, Chiba, JP;
Kasumi Takeuchi, Chiba, JP;
Shunya Takeuchi, Chiba, JP;
Hyunji Kang, Gyeonggi-Do, KR;
Akihiko Kobayashi, Chiba, JP;
Dupont Toray Specialty Materials Kabushiki Kaisha, Tokyo, JP;
DuPont Specialty Materials Korea Ltd., Chenonan-si, KR;
Abstract
Curable silicone compositions, encapsulants including the same, and optical semiconductor devices including the encapsulants are provided herein. In an embodiment, a curable silicone composition includes: (A) an alkenyl group-containing organopolysiloxane having at least two alkenyl groups per molecule; (B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; (C) an epoxy group-containing resinous organopolysiloxane represented by Average Unit Formula (I): (RSiO)(RSiO)(RSiO)(SiO)(XO)wherein Rare independently halogen-substituted or unsubstituted monovalent hydrocarbon groups, at least two Rare alkenyl groups; Rare independently halogen-substituted or unsubstituted monovalent hydrocarbon groups or epoxy group-containing organic groups, wherein at least one Ris an epoxy group-containing organic group; X is a hydrogen atom or an alkyl group; 0≤f<1; 0<g<1; 0≤h<0.9; 0≤i<0.5; and 0<j<0.5; f+g+h+i+j=1.0; h+i>0; and j/(f+g+h+i+j)>0.05 and (D) a curing catalyst.