logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12252613 B1

PDFFull Text
Date of Patent:
Mar. 18, 2025

Filed:

Oct. 30, 2024

Packaging film and preparation method thereof, and filter chip packaging method

Applicant:

Wuhan Choice Technology Co., Ltd., Wuhan, CN;

Inventors:

De Wu, Wuhan, CN;

Ting Li, Wuhan, CN;

Shuhang Liao, Wuhan, CN;

Junxing Su, Wuhan, CN;

Assignee:

WUHAN CHOICE TECHNOLOGY CO., LTD., Wuhan, CN;

Attorney:

Bayramoglu Law Offices LLC

Primary Examiner:

Gregory Listvoyb

Int. Cl.
CPC ...
C09J 163/00 (2006.01); C08J 5/18 (2006.01); C08K 3/36 (2006.01); C08K 5/315 (2006.01); C08K 5/357 (2006.01); C08K 7/18 (2006.01); C08L 71/10 (2006.01); H01L 21/56 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
C08L 71/10 (2013.01); C08J 5/18 (2013.01); C08K 3/36 (2013.01); C08K 5/3155 (2013.01); C08K 5/357 (2013.01); C08K 7/18 (2013.01); H01L 21/56 (2013.01); H01L 23/293 (2013.01); C08J 2371/10 (2013.01);
Abstract

A packaging film and a preparation method thereof, and a filter chip packaging method are provided. The raw materials of the packaging film include: 20-24 parts by mass of silicon dioxide, 24-26 parts by mass of aliphatic polyurethane acrylate, 12-15 parts by mass of phenoxy resin, 5-13 parts by mass of flexible liquid epoxy resin, 10 parts by mass of bisphenol F epoxy resin, 17-19 parts by mass of curing agent, 2-5 parts by mass of photoinitiator, and 0.4-0.8 parts by mass of accelerant, where the curing agent is compounded by bisphenol F-based benzoxazine curing agent and dicyandiamide curing agent according to the mass ratio of 10:(7-9). The packaging film has excellent flexibility and adhesion, a low moisture absorption rate, and high heat resistance and is especially suitable for the packaging of filter chips.

Find Patent Forward Citations

Loading…