The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 18, 2025

Filed:

Apr. 28, 2017
Applicant:

Divergent Technologies, Inc., Los Angeles, CA (US);

Inventors:

Eahab Nagi El Naga, Topanga, CA (US);

John Russell Bucknell, El Segundo, CA (US);

Chor Yen Yap, Gardena, CA (US);

Broc William TenHouten, Rancho Palos Verdes, CA (US);

Antonio Bernerd Martinez, El Segundo, CA (US);

Assignee:

DIVERGENT TECHNOLOGIES, INC., Los Angeles, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 3/105 (2006.01); B22F 3/02 (2006.01); B22F 3/10 (2006.01); B22F 3/16 (2006.01); B22F 3/18 (2006.01); B22F 10/28 (2021.01); B22F 10/43 (2021.01); B22F 10/47 (2021.01); B22F 10/60 (2021.01); B22F 10/66 (2021.01); B23K 26/142 (2014.01); B23K 26/342 (2014.01); B23K 26/70 (2014.01); B29C 64/386 (2017.01); B29C 64/40 (2017.01); B29C 67/00 (2017.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01); B22F 10/30 (2021.01); B22F 12/55 (2021.01); B22F 12/60 (2021.01);
U.S. Cl.
CPC ...
B29C 64/40 (2017.08); B22F 3/02 (2013.01); B22F 3/1017 (2013.01); B22F 3/164 (2013.01); B22F 3/18 (2013.01); B22F 10/28 (2021.01); B22F 10/43 (2021.01); B22F 10/47 (2021.01); B22F 10/60 (2021.01); B22F 10/66 (2021.01); B23K 26/142 (2015.10); B23K 26/342 (2015.10); B23K 26/702 (2015.10); B29C 64/386 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); B22F 10/30 (2021.01); B22F 12/55 (2021.01); B22F 12/60 (2021.01); B22F 2202/01 (2013.01); B22F 2202/06 (2013.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01);
Abstract

Systems and methods of support structures in powder-bed fusion (PBF) are provided. Support structures can be formed of bound powder, which can be, for example, compacted powder, compacted and sintered powder, powder with a binding agent applied, etc. Support structures can be formed of non-powder support material, such as a foam. Support structures can be formed to include resonant structures that can be removed by applying a resonance frequency. Support structures can be formed to include structures configured to melt when electrical current is applied for easy removal.


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