The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 11, 2025

Filed:

Aug. 19, 2020
Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventors:

Berthold Hahn, Hemau-Hohenschambach, DE;

Georg Bogner, Hainsacker/Lappersdorf, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/48 (2010.01); H10H 20/01 (2025.01); H10H 20/82 (2025.01); H10H 20/832 (2025.01); H10H 20/851 (2025.01); H10H 20/853 (2025.01); H10H 20/855 (2025.01); H10H 20/857 (2025.01);
U.S. Cl.
CPC ...
H10H 20/855 (2025.01); H10H 20/01 (2025.01); H10H 20/82 (2025.01); H10H 20/835 (2025.01); H10H 20/851 (2025.01); H10H 20/853 (2025.01); H10H 20/857 (2025.01); H10H 20/032 (2025.01); H10H 20/0363 (2025.01); H10H 20/0364 (2025.01);
Abstract

A semiconductor component includes a radiation exit surface; a semiconductor body having an active region that generates radiation; wherein a molded body molded onto the semiconductor body; contacts for external electrical contacting of the semiconductor component are accessible on an outer side of the molded body; a deflection structure arranged between the active region and the radiation exit surface; a planarization layer arranged on the deflection structure; and a polarizer arranged on a side of the planarization layer facing away from the semiconductor body; wherein the semiconductor body on a side facing away from the radiation exit surface includes a mirror structure having at least one dielectric layer and a metallic connection layer, and the dielectric layer is arranged at locations between the semiconductor body and the metallic connection layer.


Find Patent Forward Citations

Hahn, Berthold. (2025). Semiconductor component, device having a semiconductor component and method of producing semiconductor components (U.S. Patent No. 12250842). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12250842

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…