The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2025
Filed:
Jun. 18, 2019
Fuji Corporation, Chiryu, JP;
Kenji Tsukada, Toyota, JP;
FUJI CORPORATION, Chiryu, JP;
Abstract
In a method for manufacturing a circuit board according to an additive manufacturing shaping method, a circuit board manufacturing method and a circuit board manufacturing device that can reduce the influence of thermal stress on a circuit board by reducing the number of heating steps are provided. A circuit board manufacturing method according to the present disclosure includes a board shaping step of laminating and shaping a circuit board having a wiring on a peeling member adhered to a base member, an attachment step of attaching a metal paste contacting the wiring to the circuit board, an electronic component arrangement step of arranging an electronic component on the circuit board to arrange the electronic component and the wiring via the metal paste, and a heating press step of arranging a press member above the circuit board, and causing the peeling member to be easily released from the base member and curing the metal paste by collectively heating the peeling member and the metal paste while pressing the circuit board with the base member and the press member to correct warpage of the circuit board.