The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2025
Filed:
Aug. 10, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Kiyoung Jung, Suwon-si, KR;
Woosung Chun, Suwon-si, KR;
Jungchul An, Suwon-si, KR;
Seungki Choi, Suwon-si, KR;
Hyunju Hong, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
An electronic device according to various embodiments of the disclosure may include: a first housing, a second housing, a hinge assembly comprising a hinge disposed between the first housing and the second housing, and including a hinge plate and a hinge module disposed at both ends of the hinge plate in a longitudinal direction of the hinge plate, a first circuit board disposed in the first housing, a second circuit board disposed in the second housing, a flexible display disposed on the first housing, the second housing, and the hinge assembly, a first waterproof member comprising a waterproof material disposed between the first housing and the flexible display, a first adhesive member comprising an adhesive disposed between the hinge module and the flexible display, an electrical component disposed between the first waterproof member and the first adhesive member, an electrical component waterproof member comprising a waterproof material disposed between the electrical component and the flexible display, and a first support disposed between the electrical component waterproof member and the flexible display. An electrical component groove may be formed in the first housing, the electrical component may be disposed in an area of the first circuit board corresponding to the electrical component groove, and covered by the electrical component waterproof member, and a first electrical component hole coupled to the electrical component groove may be formed in a part of the first housing.