The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2025
Filed:
Sep. 09, 2022
Murata Manufacturing Co., Ltd., Kyoto, JP;
Dai Nakagawa, Kyoto, JP;
Takanori Uejima, Kyoto, JP;
Yuji Takematsu, Kyoto, JP;
Naoya Matsumoto, Kyoto, JP;
Ryohei Okabe, Kyoto, JP;
Hiromichi Kitajima, Kyoto, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
A radio frequency module includes a mounting substrate, a first electronic component, a second electronic component, a resin layer, and a shield layer. The resin layer covers outer peripheral surfaces of the first electronic component and the second electronic component. The first electronic component includes a first substrate having first and second main surfaces opposed to each other, and a first circuit section formed on the first main surface side of the first substrate. The second electronic component includes a second substrate having first and second main surfaces opposed to each other, and a second circuit section formed on the first main surface side of the second substrate. A material of the first substrate and a material of the second substrate are the same. The shield layer is in contact with the second main surface of the first substrate and the second main surface of the second substrate.