The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 11, 2025

Filed:

Aug. 30, 2022
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Hiroki Katsube, Tokyo, JP;

Shota Yamabe, Tokyo, JP;

Masakazu Tani, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H02H 7/00 (2006.01); H02M 7/00 (2006.01); H05K 5/02 (2006.01);
U.S. Cl.
CPC ...
H02M 7/003 (2013.01); H05K 5/0217 (2013.01); H05K 7/209 (2013.01); H05K 7/20927 (2013.01);
Abstract

An object is to provide a power conversion device that enables a capacitor element to be efficiently cooled, thus suppressing deterioration of the capacitor element due to heat. The power conversion device includes: a power module including a module body portion storing a semiconductor element, and a power terminal protruding from the module body portion; a capacitor module including a capacitor body portion storing a capacitor element, and a capacitor busbar protruding from the capacitor body portion and connected to the power terminal; and a housing storing the power module and the capacitor module. The housing has a first surface to which the power module is thermally connected, and a second surface to which the capacitor module is thermally connected. A coolant path for cooling the first surface is provided on a back side of the first surface. The capacitor busbar is thermally connected to the first surface.


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