The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2025
Filed:
Jan. 16, 2024
Applicant:
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Inventor:
Hirohisa Yasukawa, Kanagawa, JP;
Assignee:
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 3/13 (2006.01); H01S 5/02345 (2021.01); H01S 5/026 (2006.01); H01S 5/0235 (2021.01); H01S 5/042 (2006.01); H01S 5/0683 (2006.01);
U.S. Cl.
CPC ...
H01S 5/0261 (2013.01); H01S 5/02345 (2021.01); H01S 5/026 (2013.01); H01S 5/0262 (2013.01); H01S 5/0235 (2021.01); H01S 5/0425 (2013.01); H01S 5/0683 (2013.01);
Abstract
In a semiconductor laser drive device, a wiring inductance in electrically connecting a semiconductor laser and a laser driver is reduced. The semiconductor laser drive device includes a substrate, the laser driver, and the semiconductor laser. The laser driver is built in the substrate. The semiconductor laser is mounted on one surface of the substrate of the semiconductor laser drive device. Connection wiring electrically connects the laser driver and the semiconductor laser by a wiring inductance of 0.5 nanohenries or less.