The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 11, 2025

Filed:

Apr. 14, 2021
Applicant:

Molex, Llc, Lisle, IL (US);

Inventors:

Hazelton P. Avery, Batavia, IL (US);

Li Zhuang, Long Grove, IL (US);

Pu Xie, Naperville, IL (US);

Chia Hung Mou, Taipei, TW;

Jerry Shubert, Batavia, IL (US);

Andrew Kolak, Villa Park, IL (US);

Daniel Wenzel, Hoffman Estates, IL (US);

Dominic Steier, Naperville, IL (US);

Scott D. Sommers, Naperville, IL (US);

Assignee:

Molex, LLC, Lisle, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/6471 (2011.01); H01R 12/70 (2011.01); H01R 12/71 (2011.01); H01R 13/502 (2006.01); H01R 13/629 (2006.01); H01R 13/6583 (2011.01); H01R 13/6587 (2011.01); H01R 43/24 (2006.01); H01R 12/72 (2011.01); H01R 13/504 (2006.01); H01R 13/506 (2006.01); H01R 13/514 (2006.01); H01R 13/646 (2011.01); H01R 13/6461 (2011.01); H01R 13/658 (2011.01); H01R 13/6581 (2011.01); H01R 13/659 (2011.01);
U.S. Cl.
CPC ...
H01R 13/6471 (2013.01); H01R 12/707 (2013.01); H01R 12/71 (2013.01); H01R 13/502 (2013.01); H01R 13/629 (2013.01); H01R 13/6583 (2013.01); H01R 13/6587 (2013.01); H01R 43/24 (2013.01); H01R 12/7011 (2013.01); H01R 12/7064 (2013.01); H01R 12/72 (2013.01); H01R 12/721 (2013.01); H01R 12/727 (2013.01); H01R 13/504 (2013.01); H01R 13/506 (2013.01); H01R 13/514 (2013.01); H01R 13/646 (2013.01); H01R 13/6461 (2013.01); H01R 13/658 (2013.01); H01R 13/6581 (2013.01); H01R 13/659 (2013.01);
Abstract

High-speed connectors and connector assemblies that include structures for alignment and/or improved thermal performance. In one example, a connector assembly, comprising: a housing comprising a port; a wafer assembly with contacts positioned in the port of the housing, the wafer assembly comprising a row of conductors, the row of conductors comprising a plurality of communication signal conductors and a plurality of ground conductors arranged in the row of conductors, wherein each communication signal conductor is positioned next to a ground conductor among the plurality of ground conductors in the row of conductors; and a ground path assembly comprising the plurality of ground conductors, a conductive ground shield, and a metal ground shield insert that is stitch mated with the conductive ground shield.


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