The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 11, 2025

Filed:

Jul. 15, 2020
Applicants:

Autonetworks Technologies, Ltd., Mie, JP;

Sumitomo Wiring Systems, Ltd., Mie, JP;

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventors:

Xueqing Dong, Mie, JP;

Hiroomi Hiramitsu, Mie, JP;

Yuto Sato, Mie, JP;

Masato Tsutsuki, Mie, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H01M 10/42 (2006.01); H01M 10/48 (2006.01); H01M 10/653 (2014.01); H01M 10/655 (2014.01); H01M 50/204 (2021.01); H01M 50/502 (2021.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01M 10/482 (2013.01); H01M 10/425 (2013.01); H01M 10/653 (2015.04); H01M 10/655 (2015.04); H01M 50/204 (2021.01); H01M 50/502 (2021.01); H05K 1/11 (2013.01); H05K 1/189 (2013.01);
Abstract

A temperature measurement module is for measuring the temperature of a temperature measurement target and includes a flexible printed circuit board that includes an insulating sheet member and circuit patterns routed in the sheet member, a temperature sensor attached to the flexible printed circuit board, and a heat transfer member thermally fixed to the temperature sensor. The sheet member is provided with through holes located outward of a region overlapped with the temperature sensor, and the heat transfer member includes heat receiving portions that are arranged inside the through holes and receive heat from the temperature measurement target.


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