The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2025
Filed:
Nov. 30, 2021
Fuji Electric Co., Ltd., Kawasaki, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Takeshi Tawara, Tsukuba, JP;
Tomonori Mizushima, Matsumoto, JP;
Shinichiro Matsunaga, Matsumoto, JP;
Kensuke Takenaka, Tsukuba, JP;
Manabu Takei, Shiojiri, JP;
Hidekazu Tsuchida, Yokosuka, JP;
Kouichi Murata, Yokosuka, JP;
Akihiro Koyama, Tokyo, JP;
Koji Nakayama, Tsukuba, JP;
Mitsuru Sometani, Tsukuba, JP;
Yoshiyuki Yonezawa, Tsukuba, JP;
Yuji Kiuchi, Tsukuba, JP;
FUJI ELECTRIC CO., LTD., Kawasaki, JP;
MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;
Abstract
A silicon carbide semiconductor device has an active region and a termination structure portion disposed outside of the active region. The silicon carbide semiconductor device includes a semiconductor substrate of a second conductivity type, a first semiconductor layer of the second conductivity type, a second semiconductor layer of a first conductivity type, first semiconductor regions of the second conductivity type, second semiconductor regions of the first conductivity type, a gate insulating film, a gate electrode, a first electrode, and a second electrode. During bipolar operation, a smaller density among an electron density and a hole density of an end of the second semiconductor layer in the termination structure portion is at most 1×10/cm.