The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 11, 2025

Filed:

May. 31, 2021
Applicants:

Beijing Boe Sensor Technology Co., Ltd., Beijing, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Kuiyuan Wang, Beijing, CN;

Cheng Li, Beijing, CN;

Yue Geng, Beijing, CN;

Yi Dai, Beijing, CN;

Zefei Li, Beijing, CN;

Chaoyang Qi, Beijing, CN;

Zhonghuan Li, Beijing, CN;

Xiaoguan Li, Beijing, CN;

Congcong Xi, Beijing, CN;

Yajie Feng, Beijing, CN;

Yingzi Wang, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06V 40/13 (2022.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14607 (2013.01); G06V 40/1318 (2022.01); H01L 27/1462 (2013.01); H01L 27/14612 (2013.01);
Abstract

A fingerprint recognition module is disclosed, and including: a base substrate; a driving circuit layer disposed on a side of the base substrate, and including a plurality of driving transistors arranged in an array; a first insulating layer disposed on a side of the driving circuit layer facing away from the base substrate, and including a plurality of first via holes running through the first insulating layer in a thickness direction of the first insulating layer; a plurality of photoelectric converters disposed on a side of the first insulating layer facing away from the driving circuit layer, and in contact with first electrodes of the plurality of driving transistors through the plurality of first via holes in one-to-one correspondence; a second insulating layer disposed on a side of the first insulating layer facing away from the base substrate.


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