The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2025
Filed:
May. 20, 2020
Jcet Group Co., Ltd., Wuxi, CN;
Yaojian Lin, Wuxi, CN;
Xueqing Chen, Wuxi, CN;
Shasha Zhou, Wuxi, CN;
Jian Chen, Wuxi, CN;
Shuo Liu, Wuxi, CN;
Danfeng Yang, Wuxi, CN;
JCET GROUP CO., LTD., Wuxi, CN;
Abstract
The present invention provides an SIP package structure. The SIP package structure comprises a first module, a second module and a shielding assembly, wherein the first module and the second module are horizontally distributed or vertically stacked; electromagnetic sensitive frequencies of the first module and the second module are different; the shielding assembly comprises a first shielding structure covering the first module and a second shielding structure covering the second module; and at least part of the first shielding structure and/or at least part of the second shielding structure are/is disposed between the first module and the second module.