The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2025
Filed:
Sep. 13, 2021
Samsung Electronics Co., Ltd., Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor device includes a substrate comprising a redistribution layer, a ball land provided on a bottom surface of the redistribution layer, a passivation layer surrounding the ball land on the bottom surface of the redistribution layer and spaced apart from the ball land by a space region formed between the passivation layer and the ball land, and a signal wiring line provided in the redistribution layer on the ball land, a semiconductor chip mounted on the substrate, and an external terminal adhered to the ball land. The signal wiring line includes a first wiring pattern extending in a first direction perpendicular to one side surface of the semiconductor chip, and a support pattern disposed under the one side surface of the semiconductor chip. A second width of the support pattern in a second direction is greater than a first width of the wiring pattern in the second direction.