The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 11, 2025

Filed:

Mar. 17, 2021
Applicant:

Centre National DE LA Recherche Scientifique, Paris, FR;

Inventors:

Sylvain Martin, Grenoble, FR;

Julien Louche, Saint-Martin-le-Vinoux, FR;

Marc Drouard, Valence, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 11/16 (2006.01); H10B 61/00 (2023.01); H10N 50/01 (2023.01); H10N 50/10 (2023.01); H10N 50/80 (2023.01); H10N 50/85 (2023.01); H10N 59/00 (2023.01);
U.S. Cl.
CPC ...
G11C 11/161 (2013.01); G11C 11/1675 (2013.01); H10B 61/00 (2023.02); H10B 61/10 (2023.02); H10N 50/01 (2023.02); H10N 50/10 (2023.02); H10N 50/80 (2023.02); H10N 50/85 (2023.02); H10N 59/00 (2023.02);
Abstract

The present disclosure concerns a method for fabricating a magnetoresistive element comprising a magnetic tunnel junction including a tunnel barrier layer, a first ferromagnetic layer and a second ferromagnetic layer; a writing current layer; and an interconnect layer configured for supplying the writing current to the writing current layer. A gap is provided in the interconnect layer such that the latter comprises two discontinuous interconnect segments extending along a layer plane and connecting the writing current layer in series. The method comprises: depositing the interconnect layer, writing current layer, second ferromagnetic layer, tunnel barrier layer and first ferromagnetic layer; forming the gap in the interconnect layer; filling the gap with the gap material; and forming the pillar by performing a single etch step until the interconnect layer, acting as a stop layer, is reached.


Find Patent Forward Citations

Loading…