The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 11, 2025

Filed:

Dec. 22, 2022
Applicant:

Dongguan Luxshare Technologies Co., Ltd, Dongguan, CN;

Inventors:

Chung-Hsin Fu, Taipei, TW;

Min-Sheng Kao, Taipei, TW;

ChunFu Wu, Dongguan, CN;

Yi-Tseng Lin, Taipei, TW;

Chih-Wei Yu, Taipei, TW;

Chien-Tzu Wu, Taipei, TW;

QianBing Yan, Dongguan, CN;

Yueh-Kuo Lin, Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/12 (2006.01); H01S 3/00 (2006.01); H01S 3/02 (2006.01); H01S 3/04 (2006.01);
U.S. Cl.
CPC ...
G02B 6/12004 (2013.01); H01S 3/0071 (2013.01); H01S 3/025 (2013.01); H01S 3/0405 (2013.01); G02B 2006/12102 (2013.01); G02B 2006/12104 (2013.01); G02B 2006/12121 (2013.01); G02B 2006/1213 (2013.01);
Abstract

Disclosed is an optical module, including a lower housing, an upper housing covering the lower housing, a circuit board, a first metal base, a second metal base, a silicon photonic chip, and a light emission module including a laser chip and an optical path assembly. The first metal base is disposed on one side of the upper housing. The second metal base is disposed on one side of the lower housing. The circuit board with a hollow region is disposed on the second metal base. The silicon photonic chip is disposed on the second metal base exposed from the hollow region. The laser chip is disposed on the first metal base. The optical path assembly is disposed on the first metal base and/or on the second metal base exposed from the hollow region, and guides a third optical signal emitted by the laser chip to the silicon photonic chip.


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