The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2025
Filed:
Jan. 21, 2021
Applicant:
Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;
Inventors:
Yukiko Kitabatake, Ageo, JP;
Masahiro Koide, Ageo, JP;
Rintaro Ishii, Ageo, JP;
Yoshinori Matsuura, Ageo, JP;
Assignee:
MITSUI MINING & SMELTING CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/04 (2006.01); C03C 17/36 (2006.01); C23C 14/00 (2006.01); C23C 14/02 (2006.01); C23C 14/06 (2006.01); C23C 14/18 (2006.01); C23C 14/35 (2006.01); C23C 14/58 (2006.01); H05K 3/02 (2006.01);
U.S. Cl.
CPC ...
C23C 14/0005 (2013.01); C03C 17/3615 (2013.01); C03C 17/3618 (2013.01); C03C 17/3626 (2013.01); C03C 17/3649 (2013.01); C23C 14/0036 (2013.01); C23C 14/024 (2013.01); C23C 14/0641 (2013.01); C23C 14/185 (2013.01); C23C 14/35 (2013.01); C23C 14/5853 (2013.01); H05K 3/025 (2013.01); C03C 2218/155 (2013.01); C03C 2218/156 (2013.01); C03C 2218/322 (2013.01); H05K 2203/0152 (2013.01); H05K 2203/0156 (2013.01); H05K 2203/016 (2013.01);
Abstract
Provided is a carrier-attached metal foil which can suppress the number of foreign matter particles on the surface of a metal layer to enhance circuit formability, and can keep stable releasability even after heating at a high temperature of 240° C. or higher (for example, 260° C.) for a long period of time. The carrier-attached metal foil includes a carrier, a release functional layer provided on the carrier, the release functional layer including a metal oxynitride, and a metal layer provided on the release functional layer.