The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2025
Filed:
Oct. 29, 2020
Sumit Bahl, Knoxville, TN (US);
Ryan R. Dehoff, Knoxville, TN (US);
Hunter B. Henderson, Livermore, CA (US);
Scott Mccall, Livermore, CA (US);
Ryan Ott, Ames, IA (US);
Alexander J. Plotkowski, Knoxville, TN (US);
Orlando Rios, Knoxville, TN (US);
Amit Shyam, Knoxville, TN (US);
Zachary C. Sims, Knoxville, TN (US);
Kevin D. Sisco, Knoxville, TN (US);
David Weiss, Manitowoc, WI (US);
Ying Yang, Knoxville, TN (US);
Sumit Bahl, Knoxville, TN (US);
Ryan R. Dehoff, Knoxville, TN (US);
Hunter B. Henderson, Livermore, CA (US);
Scott McCall, Livermore, CA (US);
Ryan Ott, Ames, IA (US);
Alexander J. Plotkowski, Knoxville, TN (US);
Orlando Rios, Knoxville, TN (US);
Amit Shyam, Knoxville, TN (US);
Zachary C. Sims, Knoxville, TN (US);
Kevin D. Sisco, Knoxville, TN (US);
David Weiss, Manitowoc, WI (US);
Ying Yang, Knoxville, TN (US);
UT-Battelle, LLC, Oak Ridge, TN (US);
Lawrence Livermore National Security, LLC, Livermore, CA (US);
Iowa State University Research Foundation, Inc., Ames, IA (US);
University of Tennessee Research Foundation, Knoxville, TN (US);
Abstract
Disclosed herein are embodiments of an Al—Ce—Cu alloy for use in additive manufacturing. The disclosed alloy embodiments provide fabricated objects, such as bulk components, comprising a heterogeneous microstructure and having good mechanical properties even when exposed to conditions used during the additive manufacturing process. Methods for making and using alloy embodiments also are disclosed herein.