The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 11, 2025

Filed:

Aug. 09, 2021
Applicant:

Hanon Systems, Daejeon, KR;

Inventors:

Seong Hun Kim, Daejeon, KR;

Sung Je Lee, Daejeon, KR;

Hae Jun Lee, Daejeon, KR;

Assignee:

HANON SYSTEMS, Daejeon, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B60H 1/00 (2006.01); F25B 41/31 (2021.01);
U.S. Cl.
CPC ...
B60H 1/00899 (2013.01); B60H 1/00392 (2013.01); F25B 41/31 (2021.01); F25B 2400/23 (2013.01); F25B 2500/31 (2013.01);
Abstract

A vapor injection module may include an expansion valve configured to allow a condensed refrigerant to pass therethrough or expand a condensed refrigerant in accordance with an air conditioning mode, and a gas-liquid separator configured to receive the refrigerant from the expansion valve and separate the refrigerant into a gaseous refrigerant and a liquid refrigerant, in which the expansion valve has a plurality of expansion regions and performs operations of allowing the refrigerant to pass therethrough, performing first-stage expansion on the refrigerant, or performing second-stage expansion on the refrigerant in accordance with arrangement positions of the expansion regions.


Find Patent Forward Citations

Quick Actions:

Kim, Seong. (2025). Vapor injection module and heat pump system using same (U.S. Patent No. 12246579). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12246579

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