The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2025
Filed:
Sep. 24, 2021
Applicant:
Nippon Electric Glass Co., Ltd., Shiga, JP;
Inventor:
Toru Shiragami, Shiga, JP;
Assignee:
NIPPON ELECTRIC GLASS CO., LTD., Shiga, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 37/12 (2006.01); B32B 17/06 (2006.01); B32B 37/10 (2006.01);
U.S. Cl.
CPC ...
B32B 37/1207 (2013.01); B32B 17/06 (2013.01); B32B 37/10 (2013.01); B32B 2037/1238 (2013.01); B32B 2250/02 (2013.01); B32B 2255/20 (2013.01); B32B 2310/0843 (2013.01); B32B 2313/00 (2013.01); B32B 2315/08 (2013.01); B32B 2457/20 (2013.01);
Abstract
A bonding step in a method of producing a bonded body includes a first bonding step of forming a sealing layer () by irradiating a sealing material () belonging to an inner group (IG) with a laser beam (L), and a second bonding step of forming a sealing layer () by irradiating a sealing material () belonging to an outer group (OG) with the laser beam (L) after the first bonding step.