The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2025
Filed:
Sep. 09, 2021
Applicant:
SK Enpulse Co., Ltd., Gyeonggi-do, KR;
Inventors:
Assignee:
SK ENPULSE CO., LTD., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/00 (2012.01); B24B 37/005 (2012.01); B24B 37/013 (2012.01); B24B 37/20 (2012.01); B24B 37/22 (2012.01); B24B 37/24 (2012.01); B24B 37/26 (2012.01); B24B 49/12 (2006.01); H01L 21/02 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
B24B 37/013 (2013.01); B24B 37/005 (2013.01); B24B 37/205 (2013.01); B24B 37/22 (2013.01); B24B 37/24 (2013.01); B24B 37/26 (2013.01); B24B 49/12 (2013.01); H01L 21/02013 (2013.01); H01L 22/26 (2013.01);
Abstract
The present disclosure relates to an endpoint detection window of a polishing pad for use in a polishing process. The polishing pad may prevent an error in detection of the endpoint of the polishing process by preventing a difference in endpoint detection performance from occurring due to a difference in the wavelength of a laser between polishing apparatuses. The present disclosure may also provide a method of fabricating a semiconductor device using the polishing pad.