The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 11, 2025

Filed:

Dec. 23, 2020
Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Yuki Ikejiri, Otsu, JP;

Jun Yoshida, Otsu, JP;

Koji Kitamura, Otsu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01D 39/16 (2006.01); B01D 46/52 (2006.01); D04H 3/011 (2012.01); D04H 3/147 (2012.01);
U.S. Cl.
CPC ...
B01D 39/1623 (2013.01); B01D 46/521 (2013.01); D04H 3/011 (2013.01); D04H 3/147 (2013.01); B01D 2239/0627 (2013.01); D10B 2505/04 (2013.01);
Abstract

A spunbond non-woven fabric includes a thermoplastic continuous filament. Bending resistance in a machine direction of the spunbond non-woven fabric is 40 mN or more and 80 mN or less, the spunbond non-woven fabric includes a nonbonded projected part and a bonded recessed part, and in a non-woven fabric cross-section, a thickness from one surface to another surface of the projected part is determined to be t, a thickness from one surface to another surface of the recessed part is determined to be t, and respective distances from one surface of the projected part to one surface of the recessed part are determined to be tand t(t<t), and the spunbond non-woven fabric has a relation represented by formulas (1) and (2) below:0.5≤1−<1.0  (1)0.65<<1.0  (2).


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