The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 04, 2025

Filed:

Jun. 08, 2020
Applicant:

University of Notre Dame Du Lac, South Bend, IN (US);

Inventors:

Yanliang Zhang, South Bend, IN (US);

Mortaza Saeidi-Javash, South Bend, IN (US);

Assignee:

UNIVERSITY OF NOTRE DAME DU LAC, South Bend, IN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10N 10/852 (2023.01); C09D 7/40 (2018.01); C09D 7/61 (2018.01); C09D 11/322 (2014.01); C09D 11/36 (2014.01); C09D 11/38 (2014.01); C09D 11/52 (2014.01); H10N 10/01 (2023.01);
U.S. Cl.
CPC ...
H10N 10/852 (2023.02); C09D 7/61 (2018.01); C09D 7/66 (2018.01); C09D 11/322 (2013.01); C09D 11/36 (2013.01); C09D 11/38 (2013.01); C09D 11/52 (2013.01); H10N 10/01 (2023.02);
Abstract

Methods, ink compositions, and 3D conformal printed flexible films. The method may include aerosol jet printing a thermoelectric ink composition, followed by photonic or other sintering of the ink to remove surfactant included therein, and to convert the thermoelectric nanoparticles of the ink composition into a dense structure capable of charge carrier transport. The ink compositions may be solution-processed semimetal-chalcogenides (e.g., Te containing materials) in a suitable carrier (e.g., polyol(s), alcohol(s), etc.). A surfactant (e.g., PVP) may be present in the ink. Within seconds of photonic sintering, the electrical conductivity of the printed film is dramatically increased from non-conductive to a value on the order of at least 1×10S/m. The films may demonstrate a room-temperature power factor of at least 500 μWmK. The realized values of 730-2200 μWmKachieved are among the highest values reported for flexible thermoelectric films. The film is durable (e.g., 500 bending cycles with no significant performance drop).


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