The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 04, 2025

Filed:

Mar. 20, 2020
Applicant:

Lyft, Inc., San Francisco, CA (US);

Inventors:

Adam Christopher Bender, Mountain View, CA (US);

Nikola Popov, Burlingame, CA (US);

Chen-Yu Lin, Santa Clara, CA (US);

Assignee:

Lyft, Inc., San Francisco, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); B60W 10/08 (2006.01); H01L 23/34 (2006.01); H01L 23/367 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 7/209 (2013.01); H01L 23/34 (2013.01); H01L 23/3675 (2013.01); H05K 1/021 (2013.01); B60W 10/08 (2013.01); H05K 1/0204 (2013.01); H05K 7/20454 (2013.01); H05K 7/205 (2013.01); H05K 2201/066 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/09072 (2013.01); H05K 2201/09545 (2013.01); H05K 2201/10416 (2013.01); H05K 2201/10666 (2013.01);
Abstract

A micromobility transit vehicle may include a wheel, an electric motor associated with the wheel, and a motor controller configured to control a motive force provided by the electric motor to the wheel. The motor controller may include a printed circuit board (PCB), one or more MOSFETs attached to the PCB, and a respective aperture defined through the PCB below each MOSFET. The motor controller may include a thermal assembly associated with each MOSFET and capable of dissipating heat from the MOSFETs to a heat sink. Each thermal assembly may include a heat transfer plug positioned at least partially within an associated aperture of the PCBA to contact an associated MOSFET, and a thermal interface material positioned between the heat transfer plug and the heat sink and capable of dissipating heat from the heat transfer plug to the heat sink.


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