The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2025
Filed:
Nov. 13, 2019
Applicant:
Fuji Corporation, Chiryu, JP;
Inventors:
Akihiro Kawajiri, Chiryu, JP;
Ryojiro Tominaga, Okazaki, JP;
Assignee:
FUJI CORPORATION, Chiryu, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 13/00 (2006.01); B29C 64/112 (2017.01); B29C 64/236 (2017.01); B29C 64/245 (2017.01); B33Y 10/00 (2015.01); H05K 3/10 (2006.01); H05K 3/12 (2006.01); H05K 13/04 (2006.01); B29L 31/34 (2006.01); B33Y 30/00 (2015.01); B33Y 40/00 (2020.01);
U.S. Cl.
CPC ...
H05K 13/0061 (2013.01); B29C 64/112 (2017.08); B29C 64/236 (2017.08); B29C 64/245 (2017.08); H05K 3/10 (2013.01); H05K 3/125 (2013.01); H05K 13/0417 (2013.01); H05K 13/0452 (2013.01); H05K 13/0469 (2013.01); B29L 2031/3425 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 40/00 (2014.12);
Abstract
A three-dimensional molding machine for manufacturing a three-dimensional molded object comprising an electronic circuit includes multiple modules disposed adjacent to each other, a work unit provided in each of the multiple modules and configured to share a manufacturing operation for manufacturing the three-dimensional molded object on a pallet, and a pallet conveyance section provided in each of the multiple modules and configured to convey the pallet into and out of a module and to transfer the pallet between the module and another adjacent module of the multiple modules.