The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2025
Filed:
Feb. 24, 2023
Murata Manufacturing Co., Ltd., Kyoto, JP;
Hirofumi Oie, Kyoto, JP;
Ikuo Deguchi, Kyoto, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
A high-frequency electronic component includes a ceramic multilayer substrate, ground electrodes provided at different layers of the ceramic multilayer substrate, and a shielding film covering at least a side surface among surfaces of the ceramic multilayer substrate. Two or more of the ground electrodes are exposed to the side surface of the ceramic multilayer substrate and are electrically connected to the shielding film. On the side surface of the ceramic multilayer substrate, the two or more of the ground electrodes do not overlap each other in a thickness direction of the ceramic multilayer substrate.