The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 04, 2025

Filed:

Mar. 17, 2023
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventor:

Tadashi Nomura, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0218 (2013.01); H05K 1/181 (2013.01); H05K 1/186 (2013.01); H05K 3/28 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10189 (2013.01); H05K 2203/0271 (2013.01); H05K 2203/308 (2013.01);
Abstract

A cap including a side wall portion having conductivity, a lid portion, a thin portion formed at least around the lid portion, and a beam portion supporting the lid portion is formed, an exposed component and a sealing component are mounted on a module substrate, the cap is mounted on the module substrate so as to surround an exposed component, the sealing component and the cap are sealed with a sealing resin, the lid portion is ground so as to reduce its thickness until the thin portion disappears, a shield layer is formed on an outer surface of the sealing resin and a side surface of the module substrate, a translucent adhesive sheet is attached on a top surface of the sealing resin, the beam portion is cut by laser through the adhesive sheet, and the adhesive sheet is peeled together with a lid portion.


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