The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2025
Filed:
Dec. 30, 2021
Wuhan Xinxin Semiconductor Manufacturing Co., Ltd., Hubei, CN;
Guoliang Ye, Hubei, CN;
Abstract
The present invention provides a method of forming a metal grid, a backside illuminated (BSI) image sensor, and a method of forming the BSI image sensor. In the methods, an etch stop layer and a metal material layer are successively deposited in geometric conformity over a substrate already formed therein with a recess and a conductive pillar, followed by the formation of a bonding pad on the metal material layer in the recess. After that, a dielectric cap layer is deposited and etched together with the metal material layer and the etch stop layer to form the metal grid. According to the present invention, the deposited metal material layer has reduced surface roughness, which results in improved thickness uniformity of the resulting metal grid. The metal grid is overall easier to form, resulting in savings in cost and increased performance of the device being fabricated.