The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 04, 2025

Filed:

Dec. 13, 2021
Applicant:

Murata Manufacturing Co., Ltd., Kyoto-fu, JP;

Inventors:

Shunji Yoshimi, Nagaokakyo, JP;

Satoshi Goto, Nagaokakyo, JP;

Mikiko Fukasawa, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03F 3/04 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01L 25/065 (2023.01); H03F 1/02 (2006.01); H03F 3/14 (2006.01); H03F 3/19 (2006.01); H03F 1/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/49822 (2013.01); H01L 25/0657 (2013.01); H03F 1/0211 (2013.01); H03F 3/19 (2013.01); H01L 2223/6655 (2013.01); H01L 2225/06517 (2013.01); H03F 1/56 (2013.01); H03F 2200/387 (2013.01); H03F 2200/451 (2013.01);
Abstract

In a semiconductor device, a first member having a first surface includes a plurality of circuit blocks disposed in an inner region of the first surface when the first surface is viewed in plan. The second member is joined to the first surface of the first member in surface contact with the first surface. The second member includes a plurality of first transistors that are connected in parallel to each other and form a first amplifier circuit. A conductive protrusion protrudes from the second member on an opposite side to the first member. The first transistors are disposed in a region not overlapping any of the circuit blocks in the first member in a plan view.


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