The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2025
Filed:
Dec. 16, 2021
Applicant:
Jvckenwood Corporation, Yokohama, JP;
Inventor:
Takayuki Iwasa, Yokohama, JP;
Assignee:
JVCKENWOOD Corporation, Yokohama, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 21/78 (2006.01); H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); H01L 21/78 (2013.01); H01L 23/10 (2013.01);
Abstract
A semiconductor wafer includes: a rectangular circuit formation region provided on the semiconductor wafer; an electronic circuit formed in the circuit formation region; a first seal ring formed along each of four outer peripheral parts of the circuit formation region so as to surround an outer periphery of the circuit formation region; and a second seal ring formed, in parallel with the first seal ring, on outer peripheral parts other than at least one outer peripheral part out of the four outer peripheral parts of the circuit formation region.