The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 04, 2025

Filed:

Dec. 13, 2019
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventor:

Naoki Yoshimatsu, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/053 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01); H02P 29/024 (2016.01);
U.S. Cl.
CPC ...
H01L 23/053 (2013.01); H01L 21/4817 (2013.01); H01L 23/3735 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H02P 29/024 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48175 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/181 (2013.01);
Abstract

A semiconductor device includes a laminated body, a semiconductor element, and a cooler. The laminated body includes a first conductor layer, a first insulator layer, a second conductor layer, a second insulator layer, and a third conductor layer. The first conductor layer, the first insulator layer, the second conductor layer, the second insulator layer and the third conductor layer are laminated. The first insulator layer is arranged between the first conductor layer and the second conductor layer, and electrically insulates the first conductor layer from the second conductor layer. The second insulator layer is arranged between the second conductor layer and the third conductor layer, and electrically insulates the third conductor layer from the second conductor layer. The semiconductor element is mounted on the first conductor layer. The cooler is connected to the third conductor layer.


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