The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2025
Filed:
Aug. 23, 2023
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventor:
Taesung Kim, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 23/31 (2013.01); H01L 23/3128 (2013.01);
Abstract
A carrier film for performing a semiconductor package process on a mother substrate including a multi-layer circuit, a mother substrate, and a method of manufacturing a semiconductor package, the carrier film including a base material layer having a predetermined stiffness; and an adhesive layer configured to attach the base material layer onto the mother substrate, the adhesive layer including a water soluble material, wherein the carrier film includes a plurality of openings passing therethrough from a top surface to a bottom surface thereof.