The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2025
Filed:
Dec. 23, 2022
Applicant:
Ngk Insulators, Ltd., Nagoya, JP;
Inventors:
Hiroshi Takebayashi, Handa, JP;
Joyo Ito, Handa, JP;
Assignee:
NGK INSULATORS, LTD., Nagoya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32724 (2013.01); H01L 21/6833 (2013.01); H01J 2237/0206 (2013.01); H01J 2237/0262 (2013.01); H01J 2237/2007 (2013.01); H01J 2237/334 (2013.01);
Abstract
A member for semiconductor manufacturing apparatus includes: an upper plate that has a wafer placement surface, contains no electrode, and is a ceramic material plate; an intermediate plate that is provided on a surface of the upper plate, opposite to the wafer placement surface, that is used as an electrostatic electrode, and that is a conductive material plate; and a lower plate that is joined to a surface of the intermediate plate, opposite to the surface on which the upper plate is provided, and that is a ceramic material plate.