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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12243727 B1

PDFFull Text
Date of Patent:
Mar. 04, 2025

Filed:

Aug. 16, 2022

Substrate processing apparatus including electrostatic chuck, substrate processing method, and method of manufacturing electrostatic chuck

Applicant:

Semes Co., Ltd., Cheonan-si, KR;

Inventors:

Dong Chan Lee, Anseong-si, KR;

Kyo Bong Kim, Suwon-si, KR;

Assignee:

SEMES CO., LTD., Cheonan-si, KR;

Attorneys:

PNJ IP Law, P.C.

JINSEONG PARK

Primary Examiner:

Thienvu V Tran

Assistant Examiner:

Sreeya Sreevatsa

Int. Cl.
CPC ...
H01J 37/32 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32715 (2013.01); H01L 21/6833 (2013.01); H01L 21/68742 (2013.01); H01J 2237/2007 (2013.01); H01J 2237/20235 (2013.01); H01J 2237/334 (2013.01);
Abstract

An electrostatic chuck includes a chuck body which supports a substrate, at least one pin hole penetrating the chuck body in a vertical direction, a lift pin disposed in one of the at least one pin hole, wherein the lift pin moves along the one of the at least one pin hole, and an expansion member which is provided at an inner circumference of the one of the at least one pin hole, the expansion member having an inner circumferential surface that, in response to a first power, selectively holds or releases an outer circumferential surface of the lift pin.

Find Patent Forward Citations

Lee, Dong. (2025). Substrate processing apparatus including electrostatic chuck, substrate processing method, and method of manufacturing electrostatic chuck (U.S. Patent No. 12243727). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12243727

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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