The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 04, 2025

Filed:

Jun. 05, 2024
Applicant:

Ruijie Networks Co., Ltd., Fuzhou, CN;

Inventors:

Xiaolong Lv, Fujian, CN;

Wei Liu, Fujian, CN;

Guohong Lai, Fujian, CN;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4268 (2013.01); H05K 7/20336 (2013.01); H05K 7/20509 (2013.01);
Abstract

This application discloses a heat dissipation structure for an optoelectronic module and an electronic device. The heat dissipation structure includes: an electronic chip; a plurality of optical engines, the plurality of optical engines being distributed along a periphery of the electronic chip; and a cold plate. The cold plate includes: a main cold plate for dissipating heat for the electronic chip; a secondary cold plate for dissipating heat for at least one of the plurality of optical engines; and a heat pipe assembly corresponding to the secondary cold plate. The heat pipe assembly includes at least one heat pipe, which has an evaporating end connected to the secondary cold plate and a condensing end connected to the main cold plate. The main cold plate is equipped with a flow channel for dissipating heat for the heat pipe assembly, and the secondary cold plate has a maintenance operation position.


Find Patent Forward Citations

Loading…