The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2025
Filed:
Jan. 30, 2020
Applicant:
Analog Devices, Inc., Norwood, MA (US);
Inventors:
Marc T. Dunham, Foster City, CA (US);
Baoxing Chen, Westford, MA (US);
Assignee:
Analog Devices, Inc., Norwood, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28D 15/02 (2006.01); F28F 21/08 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
F28D 15/0275 (2013.01); F28D 15/0233 (2013.01); F28F 21/084 (2013.01); F28F 21/087 (2013.01); F28F 21/089 (2013.01); H05K 7/20336 (2013.01); F28F 2280/00 (2013.01);
Abstract
A heat transfer element is disclosed. The heat transfer element can be configured to directly bond to a metal surface of an element. The heat transfer element can include a chamber that is defined at least in part by a housing that has a metal portion. The heat transfer element can also include a phase change material disposed in the chamber. The phase change material can be in thermal communication with the metal portion. The Heat transfer element can be bonded to the element to define a bonded structure.