The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 04, 2025

Filed:

Sep. 10, 2020
Applicants:

Toyobo Co., Ltd., Osaka, JP;

Toagosei Co., Ltd., Tokyo, JP;

Inventors:

Shinya Watanabe, Tsuruga, JP;

Ai Koganemaru, Otsu, JP;

Hisao Okumura, Tokyo, JP;

Tomoya Sugiki, Tokyo, JP;

Takahiro Ito, Nagoya, JP;

Makoto Imahori, Nagoya, JP;

Assignees:

TOYOBA CO., LTD., Osaka, JP;

TOAGOSEI CO., LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/29 (2018.01); B32B 7/12 (2006.01); B32B 15/08 (2006.01); B32B 37/12 (2006.01); C09J 7/30 (2018.01); C09J 7/35 (2018.01); C09J 123/26 (2006.01);
U.S. Cl.
CPC ...
C09J 7/29 (2018.01); B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 37/12 (2013.01); C09J 7/30 (2018.01); C09J 7/35 (2018.01); C09J 123/26 (2013.01); C09J 2301/124 (2020.08); C09J 2423/10 (2013.01); C09J 2425/00 (2013.01);
Abstract

The invention provides a laminated body having an excellent adhesive force with respect to a low-polarity metal member in the presence of hot water. The laminated body contains a resin substrate; an easily adhesive layer provided on at least one surface of the resin substrate; and an adhesive resin layer provided on a surface of the easily adhesive layer on a side opposite to the resin substrate, wherein the adhesive resin layer contains a polyolefin having at least one group selected from the group consisting of an acidic group and an acid anhydride group and having an acid value of 0.01 mgKOH/g to 6.5 mgKOH/g; and the laminated body is used for bonding a metal member having a ratio of a dipole term in surface free energy of 0.01% to 5.0%.


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