The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2025
Filed:
Feb. 03, 2022
Jsp Corporation, Tokyo, JP;
Takumi Sakamura, Tochigi, JP;
Hajime Ohta, Tochigi, JP;
JSP CORPORATION, Tokyo, JP;
Abstract
An expanded bead having a tubular shape with a through hole and a method for producing the same are provided. The expanded bead includes a foamed core layer and a covering layer. A polyolefin-based resin included in the covering layer has a melting point lower than a melting point of a polypropylene-based resin included in the foamed core layer. An average hole diameter d of the through hole of the expanded bead is less than 1 mm, and a ratio d/D of the average hole diameter d to an average outer diameter D of the expanded bead is 0.4 or less. The polypropylene-based resin for the foamed core layer has a flexural modulus of 1,200 MPa or more and a melting point of 158° C. or lower.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile