The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 04, 2025

Filed:

Jul. 10, 2020
Applicant:

Kaneka Corporation, Osaka, JP;

Inventors:

Asuka Fukutome, Settsu, JP;

Tetsuo Okura, Settsu, JP;

Shunsuke Sato, Takasago, JP;

Assignee:

KANEKA CORPORATION, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 63/06 (2006.01); B29B 11/10 (2006.01); B29C 71/02 (2006.01); B29K 96/00 (2006.01);
U.S. Cl.
CPC ...
C08J 7/08 (2013.01); B29B 11/10 (2013.01); C08G 63/06 (2013.01); B29K 2096/00 (2013.01); C08G 2250/00 (2013.01); C08J 2367/04 (2013.01);
Abstract

A method for producing a poly(3-hydroxybutyrate) resin-containing composition for melt processing includes: heating a material containing a poly(3-hydroxybutyrate) resin to a temperature equal to or higher than a melting point peak temperature in differential scanning calorimetry analysis of the poly(3-hydroxybutyrate) resin and equal to or lower than a melting point peak end temperature in the differential scanning calorimetry analysis of the poly(3-hydroxybutyrate) resin, wherein the difference between the melting point peak temperature and the melting point peak end temperature of the poly(3-hydroxybutyrate) resin is 10° C. or more; and extruding the heated material to obtain a composition for melt processing that has a new crystallization peak at a temperature higher than the melting point peak temperature.


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