The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 04, 2025

Filed:

Apr. 13, 2023
Applicants:

View, Inc., Milpitas, CA (US);

Corning Incorporated, Corning, NY (US);

Inventors:

Ronald M. Parker, Olive Branch, MS (US);

Anshu Ajit Pradhan, Collierville, TN (US);

Abhishek Anant Dixit, Collierville, TN (US);

Douglas Samuel Dauson, Olive Branch, MS (US);

Assignees:

View Operating Corporation, San Jose, CA (US);

Corning Incorporated, Corning, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 17/10 (2006.01); B29C 65/00 (2006.01); G02F 1/1524 (2019.01); G02F 1/153 (2006.01); G02F 1/155 (2006.01);
U.S. Cl.
CPC ...
B32B 17/10807 (2013.01); B32B 17/10146 (2013.01); B32B 17/10302 (2013.01); B32B 17/10513 (2013.01); B32B 17/1088 (2013.01); B32B 17/1099 (2013.01); G02F 1/153 (2013.01); G02F 1/1533 (2013.01); G02F 1/155 (2013.01); B29C 66/006 (2013.01); B29C 66/0382 (2013.01); B29C 2793/0027 (2013.01); G02F 1/1524 (2019.01);
Abstract

Methods are provided for fabricating electrochromic devices that mitigate formation of short circuits under a top bus bar without predetermining where top bus bars will be applied on the device. Devices fabricated using such methods may be deactivated under the top bus bar, or may include active material under the top bus bar. Methods of fabricating devices with active material under a top bus bar include depositing a modified top bus bar, fabricating self-healing layers in the electrochromic device, and modifying a top transparent conductive layer of the device prior to applying bus bars.


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