The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 04, 2025

Filed:

Aug. 28, 2020
Applicant:

Nippon Steel Corporation, Tokyo, JP;

Inventors:

Masako Nakai, Tokyo, JP;

Masaharu Ibaragi, Tokyo, JP;

Noriyuki Negi, Tokyo, JP;

Masafumi Usui, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/095 (2006.01); B32B 5/02 (2006.01); B32B 7/12 (2006.01); B32B 15/082 (2006.01); B32B 15/09 (2006.01); B32B 15/18 (2006.01); B32B 15/20 (2006.01); B32B 27/12 (2006.01); B32B 27/30 (2006.01); B32B 27/36 (2006.01); B32B 27/40 (2006.01);
U.S. Cl.
CPC ...
B32B 15/095 (2013.01); B32B 5/02 (2013.01); B32B 7/12 (2013.01); B32B 15/082 (2013.01); B32B 15/09 (2013.01); B32B 15/18 (2013.01); B32B 15/20 (2013.01); B32B 27/12 (2013.01); B32B 27/302 (2013.01); B32B 27/308 (2013.01); B32B 27/36 (2013.01); B32B 27/40 (2013.01); B32B 2250/03 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2274/00 (2013.01); B32B 2307/54 (2013.01); B32B 2307/732 (2013.01); B32B 2605/08 (2013.01);
Abstract

To provide a metal-fiber reinforced resin material (FRP) composite having a good appearance even when used as an automobile outer panel and not deformed even after a coating and baking process. The metal-FRP composite of the invention has a laminated structure of three or more layers, having at least a metal layer, a fiber-reinforced resin material layer holding a reinforced fiber material in a layer constituted by a matrix resin, and a resin layer located between the metal layer and the fiber-reinforced resin material layer. The resin layer is a layer constituted by a room temperature curing adhesive or by a predetermined resin and the room temperature curing adhesive. An elastic modulus E of the resin layer is more than 0.1 MPa and 1000 MPa or less, and a thickness of the resin layer is 0.005 times or more and less than 7.500 times a thickness of the metal layer.


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