The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 04, 2025

Filed:

Jan. 13, 2023
Applicant:

Sakuu Corporation, San Jose, CA (US);

Inventors:

Morteza Vatani, Los Gatos, CA (US);

Seyed Mohammad Sajadi, San Jose, CA (US);

Steven Zhichao Shi, Santa Clara, CA (US);

David Paul Wanamaker, San Jose, CA (US);

Siamak Azizi, Los Gatos, CA (US);

Karl Littau, Los Altos Hills, CA (US);

Assignee:

Sakuu Corporation, San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/357 (2017.01); B22F 10/14 (2021.01); B22F 10/73 (2021.01); B29C 64/165 (2017.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 40/00 (2020.01);
U.S. Cl.
CPC ...
B29C 64/357 (2017.08); B22F 10/14 (2021.01); B22F 10/73 (2021.01); B29C 64/165 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 40/00 (2014.12);
Abstract

A method and system for 3D printing for creating at least two discrete sections of powder on a substrate, segmenting the substrate to isolate the at least two discrete sections of powder, compacting the powder on a segment of the substrate, removing loose/non-compacted powder from the segment of the substrate, create a printed/processed layer by performing one or more of a printing process or a processing operation on the segment of substrate, and transferring the printed/processed layers from the segment of substrate to a build platform.


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