The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2025
Filed:
Dec. 22, 2020
Seiko Epson Corporation, Tokyo, JP;
Kenta Anegawa, Matsumoto, JP;
Kei Yokota, Matsumoto, JP;
SEIKO EPSON CORPORATION, Tokyo, JP;
Abstract
To provide an injection molding machine which includes: a melting unit including a screw rotating about a rotation axis and having a groove forming surface on which a groove is formed and a barrel provided with a communication hole in a facing surface facing the groove forming surface, and configured to plasticize a material to generate a plasticized material and make the plasticized material flow out of the communication hole; a heating unit configured to heat the melting unit; an injection nozzle in communication with the communication hole and configured to inject the plasticized material into a mold; an injection control unit including a cylinder coupled to the communication hole and a plunger; a pressure detection unit configured to detect a pressure of the plasticized material flowing into the communication hole; and a control unit. The control unit controls the injection control unit to execute, based on a detected value, at least one of a metering operation of metering the plasticized material in the communication hole in the cylinder, and an injecting operation of injecting the plasticized material in the cylinder into the mold via the injection nozzle.