The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2025

Filed:

Jul. 07, 2022
Applicant:

SK Hynix Inc., Icheon-si, KR;

Inventor:

Nam Jae Lee, Cheongju-si, KR;

Assignee:

SK hynix Inc., Icheon-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H10B 12/00 (2023.01); H10B 41/27 (2023.01); H10B 10/00 (2023.01);
U.S. Cl.
CPC ...
H10B 41/27 (2023.02); H10B 12/0335 (2023.02); H10B 10/18 (2023.02);
Abstract

There are provided a semiconductor memory device and a manufacturing method thereof. The manufacturing method of the semiconductor memory device includes: forming a preliminary memory cell array that includes a gate stack structure and a channel structure wherein the gate stack structure includes interlayer insulating layers and conductive patterns, alternately stacked on a first substrate, and wherein the channel structure has a first end portion that penetrates the gate stack structure and extends into the first substrate; forming a common source line to be in contact with a second end portion of the channel structure, the common source line formed on a first surface of the gate stack structure; removing the first substrate; and forming a bit line connected to the first end portion of the channel structure on a second surface of the gate stack structure that is opposite of the first surface of the gate stack structure.


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